Patent Assignment
Reel/Frame 046889/0407
Assignment of Assignor's Interest
Recorded: 2018-09-17
Pages: 11
Assignors
WU, CHENG-TA
Executed: 2018-08-22
TSAI, CHIA-SHIUNG
Executed: 2018-08-22
LU, JIECH-FUN
Executed: 2018-08-22
TZENG, KUO-HWA
Executed: 2018-08-22
CHOU, SHIH-PEI
Executed: 2018-08-22
CHENG, YU-HUNG
Executed: 2018-08-22
TU, YEUR-LUEN
Executed: 2018-08-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method for Forming Thin Semiconductor-on-Insulator (Soi) Substrates