Patent Assignment
Reel/Frame 046889/0728
Assignment of Assignor's Interest
Recorded: 2018-09-17
Pages: 7
Assignors
LEE, HYUNCHUL
Executed: 2018-06-11
KANG, YUNSEUNG
Executed: 2018-06-11
LEE, SOUNGHEE
Executed: 2018-06-11
LEE, JISEUNG
Executed: 2018-06-11
CHUNG, SANGGYO
Executed: 2018-06-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Semiconductor Device