Assignment of Assignor's Interest

Recorded: 2018-09-17 Pages: 3

Assignor

TEH, CHEE HAK

Executed: 2017-09-28

Assignee

INTEL CORPORATION

2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054

Covered Property (1)

Modular Interconnection Repair of Multi-Die Package

Patent: 10,079,211 →

Application: 15/719,303 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.