Patent Assignment
Reel/Frame 046903/0068
Assignment of Assignor's Interest
Recorded: 2018-09-18
Pages: 6
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium