Patent Assignment
Reel/Frame 046903/0568
Assignment of Assignor's Interest
Recorded: 2018-09-18
Pages: 3
Assignor
TEH, CHEE HAK
Executed: 2017-09-28
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Modular Interconnection Repair of Multi-Die Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.