Patent Assignment
Reel/Frame 046905/0113
Assignment of Assignor's Interest
Recorded: 2018-09-19
Pages: 14
Assignors
CHEN, PO-CHUN
Executed: 2018-09-13
CHU, HSUAN-TUNG
Executed: 2018-09-13
CHEN, YI-WEI
Executed: 2018-09-13
LIU, WEI-HSIN
Executed: 2018-09-13
TUNG, YU-CHENG
Executed: 2018-09-13
CHANG, CHIA-LUNG
Executed: 2018-09-13
Assignees
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
NO.88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY, QUANZHOU CITY, FUJIAN PROVINCE, CHINA
Covered Property
(1)
Method of Forming Isolation Structure