IP Library Assignment 046905/0923
Patent Assignment
Reel/Frame 046905/0923

Assignment of Assignor's Interest

Recorded: 2018-09-19 Pages: 3
Assignors
YANG, YI
Executed: 2018-08-17
SHEN, DOGNA
Executed: 2018-08-20
SUNDAR, VIGNESH
Executed: 2018-08-17
WANG, YU-JEN
Executed: 2018-08-17
Assignee
HEADWAY TECHNOLOGIES, INC.
678 S. HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Self-Aligned Encapsulation Hard Mask to Separate Physically Under-Etched Mtj Cells to Reduce Conductive R-Deposition
Application: 16/113,079 →
Publication: US 2020/0066972
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 25, 2019
From: HEADWAY TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 048692/0917 →