Patent Assignment
Reel/Frame 046905/0926
Assignment of Assignor's Interest
Recorded: 2018-09-19
Pages: 3
Assignors
YANG, YI
Executed: 2018-08-17
SHEN, DONGNA
Executed: 2018-08-20
WANG, YU-JEN
Executed: 2018-08-17
Assignee
HEADWAY TECHNOLOGIES, INC.
678 S. HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Large Height Tree-Like Sub 30nm Vias to Reduce Conductive Material Re-Deposition for Sub 60nm MRAM Devices
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.