Patent Assignment
Reel/Frame 046907/0197
Assignment of Assignor's Interest
Recorded: 2018-09-19
Pages: 6
Assignors
KIM, JUN-HYUNG
Executed: 2018-08-25
KIM, SUNG-HYUP
Executed: 2018-08-25
LIM, KYEONG-BIN
Executed: 2018-08-11
KIM, SEOK-HO
Executed: 2018-08-11
KIM, TAE-YEONG
Executed: 2018-08-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Bonding Apparatus