IP Library › Assignment 046907/0266
Patent Assignment
Reel/Frame 046907/0266

Assignment of Assignor's Interest

Recorded: 2018-09-19 Pages: 4
Assignors
YOO, CHAN H.
Executed: 2017-10-18
TUTTLE, MARK E.
Executed: 2017-10-18
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, BOISE, IDAHO, 83716
Covered Property (1)
Stress Tuned Stiffeners for Micro Electronics Package Warpage Control
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 12 to Patent Security Agreement Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048948/0677 →
Supplement No. 3 to Patent Security Agreement Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048951/0902 →
Release of Security Interest Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050724/0392 →
Release of Security Interest Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051041/0317 →