Patent Assignment
Reel/Frame 046917/0719
Assignment of Assignor's Interest
Recorded: 2018-09-20
Pages: 8
Assignors
CHANG, FENG-YI
Executed: 2018-09-17
TUNG, YU-CHENG
Executed: 2018-09-17
LEE, FU-CHE
Executed: 2018-09-17
Assignees
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
NO.88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY, QUANZHOU CITY, FUJIAN PROVINCE, CHINA
Covered Property
(1)
Semiconductor Device and Method of Forming the Same