Assignment of Assignor's Interest

Recorded: 2018-09-20 Pages: 2

Assignor

TSENG, HUAN-CHANG

Executed: 2018-06-19

Assignee

CORETECH SYSTEM CO., LTD.

TAI YUEN HI-TECH INDUSTRIAL PARK 8F-2,, NO.32, TAIYUAN ST.,, CHUPEI CITY, HSINCHU COUNTY, 30265, TAIWAN

Covered Property (1)

Molding System for Preparing Fiber-Reinforced Thermoplastic Composite Article

Patent: 10,201,918 →

Application: 16/027,925 →

Related Assignments (3)

Other recorded transfers of the patent in this record — the chain of ownership.