Patent Assignment
Reel/Frame 046938/0674
Assignment of Assignor's Interest
Recorded: 2018-09-21
Pages: 3
Assignor
KUNIMUNE, TEPPEI
Executed: 2018-08-29
Assignee
NICHIA CORPORATION
491-100, OKA, KAMINAKA-CHO, ANAN-SHI, TOKUSHIMA, 774-8601, JAPAN
Covered Property
(1)
Method for Bonding Electronic Component and Method for Manufacturing Bonded Body