Patent Assignment
Reel/Frame 046942/0939
Assignment of Assignor's Interest
Recorded: 2018-08-24
Pages: 10
Assignors
GUO, SONG
Executed: 2018-07-30
TANG, SANH D.
Executed: 2018-08-15
TEMCHENKO, VLAD
Executed: 2018-08-18
SRIVASTAVA, SHIVANI
Executed: 2018-08-23
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 1-507, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Methods of Forming Semiconductor Devices Using Aspect Ratio Dependent Etching Effects, and Related Semiconductor Devices
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the 3RD Inventor's Execution Date Previously Recorded on Reel 046942 Frame 0939. Assignor(S) Hereby Confirms the Assignment.
Sep 25, 2018
From: GUO, SONG; TANG, SANH D.; TEMCHENKO, VLAD; SRIVASTAVA, SHIVANI
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047139/0929 →
Supplement No. 1 to Patent Security Agreement
Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A.., AS COLLATERAL AGENT
Reel/Frame 047630/0756 →
Supplement No. 10 to Patent Security Agreement
Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048102/0420 →
Release of Security Interest
Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050719/0550 →
Release of Security Interest
Nov 14, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051028/0835 →