Patent Assignment
Reel/Frame 046950/0935
Assignment of Assignor's Interest
Recorded: 2018-09-24
Pages: 7
Assignors
KIM, SOOJIN
Executed: 2018-09-06
LEE, HYO-SUN
Executed: 2018-09-06
OH, JUNG-MIN
Executed: 2018-09-03
LEE, HYOSAN
Executed: 2018-09-07
KIM, DONGHYUN
Executed: 2018-09-03
KIM, HAKSOO
Executed: 2018-09-03
OH, JUNG JAE
Executed: 2018-09-03
LEE, MYUNG HO
Executed: 2018-09-03
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
ENF TECHNOLOGY CO., LTD
14, TAPSIL-RO 35BEON-GIL, GIHEUNG-GU, YOUNGIN-SI, GYEONGGI-DO, 17084, KOREA, REPUBLIC OF
Covered Property
(1)
PRE-TREATMENT COMPOSITION BEFORE ETCHING SiGe AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME