Patent Assignment
Reel/Frame 046955/0966
Assignment of Assignor's Interest
Recorded: 2018-09-25
Pages: 4
Assignors
SHIH, YING-CHING
Executed: 2018-08-31
WU, CHIH-WEI
Executed: 2018-08-31
LU, SZU-WEI
Executed: 2018-08-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof