IP Library Assignment 046962/0329
Patent Assignment
Reel/Frame 046962/0329

Assignment of Assignor's Interest

Recorded: 2018-09-25 Pages: 3
Assignor
SEDDON, MICHAEL JOHN
Executed: 2018-09-25
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Semiconductor Die Singulation Methods
Application: 16/141,019 →
Publication: US 2019/0080965
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Nov 1, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047399/0631 →
Release of Security Interest in Patents Recorded at Reel 047399, Frame 0631 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064078/0001 →