Patent Assignment
Reel/Frame 046963/0669
Assignment of Assignor's Interest
Recorded: 2018-09-25
Pages: 3
Assignors
OKAMOTO, KEISHI
Executed: 2018-08-21
HORIBE, AKIHIRO
Executed: 2018-08-23
MORI, HIROYUKI
Executed: 2018-08-21
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Controlling of Height of High-Density Interconnection Structure on Substrate