Patent Assignment
Reel/Frame 046974/0134
Assignment of Assignor's Interest
Recorded: 2018-09-26
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package, Package-on-Package Device, and Method of Fabricating the Same