Patent Assignment
Reel/Frame 046974/0326
Assignment of Assignor's Interest
Recorded: 2018-09-26
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Forming the Same