IP Library Assignment 047002/0696
Patent Assignment
Reel/Frame 047002/0696

Assignment of Assignor's Interest

Recorded: 2018-09-28 Pages: 5
Assignor
KAEMPF, MATHIAS
Executed: 2016-03-29
Assignee
OSRAM OPTO SEMICONDUCTORS GMBH
LEIBNIZSTR. 4, REGENSBURG, 93055, GERMANY
Covered Property (1)
Method for Dividing a Composite into Semiconductor Chips, and Semiconductor Chip
Application: 15/845,883 →
Publication: US 2018/0117706
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051467/0906 →