Patent Assignment
Reel/Frame 047015/0564
Assignment of Assignor's Interest
Recorded: 2018-10-01
Pages: 6
Assignors
BAEK, SEOK CHEON
Executed: 2018-07-30
KIM, BOH CHANG
Executed: 2018-07-30
MIN, CHUNG KI
Executed: 2018-07-30
PARK, JI HOON
Executed: 2018-08-01
YOU, BYUNG KWAN
Executed: 2018-07-30
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Stack Structures Having R-Type Pad and P-Type Pad of Different Thickness