Patent Assignment
Reel/Frame 047020/0075
Assignment of Assignor's Interest
Recorded: 2018-10-01
Pages: 6
Assignee
EBARA CORPORATION
11-1, HANEDA ASAHI-CHO, OHTA-KU, TOKYO, 144-8510, JAPAN
Covered Property
(1)
Substrate Polishing Apparatus and Method