IP Library › Assignment 047025/0793
Patent Assignment
Reel/Frame 047025/0793

Assignment of Assignor's Interest

Recorded: 2018-10-01 Pages: 7
Assignors
FOONG, WEI KUONG
Executed: 2018-05-16
GOH, KOK SING
Executed: 2018-05-16
MUNDIYATH, SHAMAL
Executed: 2018-05-16
LEE, ENG KIAT
Executed: 2018-05-16
CHIN, MEI CHEN
Executed: 2018-05-16
Assignee
JF MICROTECHNOLOGY SDN. BHD.
LOT 6, JALAN TEKNOLOGI 3/6, TAMAN SAINS SELANGOR 1, KOTA DAMANSARA, PETALING JAYA, SELANGOR, 47810, MALAYSIA
Covered Property (1)
High Precision Vertical Motion Kelvin Contact Assembly
Application: 15/984,023 →
Publication: US 2018/0335473