Patent Assignment
Reel/Frame 047029/0583
Assignment of Assignor's Interest
Recorded: 2018-10-02
Pages: 5
Assignors
CHA, KYOUNG JIN
Executed: 2018-08-31
LEE, SEUNG HEUI
Executed: 2018-08-31
OH, HYUN SOO
Executed: 2018-08-31
KWON, HYUNG SOON
Executed: 2018-08-31
JO, JI HONG
Executed: 2018-08-31
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Multilayer Ceramic Electronic Component