Method of manufacturing multilayer ceramic electronic component
A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet containing a ceramic powder and forming an internal electrode pattern on the ceramic green sheet using a conductive paste containing conductive metal particles and an additive. A ceramic laminate is formed by stacking the ceramic green sheets on which the internal electrode pattern is formed. A ceramic body including dielectric layers and internal electrodes is formed by sintering the ceramic laminate. An average number of conductive metal particles in the internal electrode pattern in a thickness direction is more than 2 and 5 or less.
1. A method of manufacturing a multilayer ceramic electronic component, the method comprising:
preparing a ceramic green sheet containing a ceramic powder;
forming an internal electrode pattern on the ceramic green sheet using a conductive paste containing conductive metal particles and an additive;
forming a ceramic laminate by stacking the ceramic green sheets on which the internal electrode pattern is formed; and
forming a ceramic body including dielectric layers and internal electrodes by sintering the ceramic laminate,
wherein an average number of the conductive metal particles directly adjacent to each other in the internal electrode pattern in a thickness direction along which the ceramic green sheets are stacked is more than 2 and 5 or less.
2. The method of claim 1 , wherein the average number of the conductive metal particles disposed in the internal electrode pattern in the thickness direction is more than 3 and 5 or less.
3. The method of claim 1 , wherein the internal electrode pattern has a thickness of 0.5 μm or less.
4. The method of claim 1 , wherein the ceramic green sheet has a thickness of 0.6 μm or less.
5. The method of claim 1 , wherein an average number of ceramic powder particles disposed in the ceramic green sheet in the thickness direction is 2 or more to 10 or less.
6. The method of claim 1 , wherein connectivity of the internal electrode defined as a ratio of a length of an actual internal electrode to a total length of the internal electrode is 80% or more.
7. The method of claim 1 , wherein after the sintering, one of the internal electrodes has a thickness of 0.4 μm or less.
8. The method of claim 1 , wherein after the sintering, one of the dielectric layers has a thickness of 0.4 μm or less.
9. The method of claim 1 , further comprising forming external electrodes on surfaces of the ceramic body to electrically connect to the internal electrodes exposed from the surfaces of the ceramic body, respectively.