Patent Assignment
Reel/Frame 047039/0908
Assignment of Assignor's Interest
Recorded: 2018-10-02
Pages: 6
Assignors
CHO, JUNGHYUN
Executed: 2018-08-03
PARK, SANG-GEUN
Executed: 2018-08-03
BAEK, DONGSEOK
Executed: 2018-08-03
CHOI, JAEHYUK
Executed: 2018-08-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packaging Apparatus and Method of Manufacturing Semiconductor Device Using the Same