IP Library Assignment 047051/0882
Patent Assignment
Reel/Frame 047051/0882

Assignment of Assignor's Interest

Recorded: 2018-10-03 Pages: 3
Assignor
DIALOG SEMICONDUCTOR (UK) LIMITED
Executed: 2018-10-01
Assignee
DIALOG SEMICONDUCTOR B.V.
HET ZUIDERKRUIS 53, 'S-HERTOGENBOSCH, 5215 MV, NETHERLANDS
Covered Property (1)
Wafer Level Molded PPGA (Pad Post Grid Array) for Low Cost Package
Application: 15/835,580 →
Publication: US 2019/0181115
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 7, 2018
From: HU, SHOU CHENG ERIC; BELONIO, JESUS MENNEN, JR
To: DIALOG SEMICONDUCTOR (UK) LIMITED
Reel/Frame 045269/0834 →