Patent Assignment
Reel/Frame 047057/0351
Assignment of Assignor's Interest
Recorded: 2018-10-03
Pages: 6
Assignors
YU, HYE SEUNG
Executed: 2018-07-30
YUN, WON JOO
Executed: 2018-08-16
LEE, HYUN UI
Executed: 2018-08-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Memory Package and Memory Device Utilizing an Intermediate Chip