Patent Assignment
Reel/Frame 047059/0777
Assignment of Assignor's Interest
Recorded: 2018-10-03
Pages: 4
Assignors
LEE, SHEN-NAN
Executed: 2018-09-21
HOU, TE-CHIEN
Executed: 2018-09-21
TSAI, TENG-CHUN
Executed: 2018-09-21
HSU, CHUNG-WEI
Executed: 2018-09-21
WU, CHEN-HAO
Executed: 2018-09-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method for Conditioning Polishing Pad