IP Library Assignment 047062/0262
Patent Assignment
Reel/Frame 047062/0262

Merger

Recorded: 2018-09-12 Pages: 4
Assignor
HYSITRON, INCORPORATED
Executed: 2017-01-23
Assignee
BRUKER NANO, INC.
112 ROBIN HILL ROAD, SANTA BARBARA, CALIFORNIA, 93117
Covered Properties (13)
In-Situ Non-Destructive Audiosonic Identification System for Visco-Elastic Materials
Patent: 6,289,734 →
Application: 09/259,737 →
Method for Observation of Microstructural Surface Features in Heterogeneous Materials
Patent: 7,107,694 →
Application: 10/881,302 →
Publication: US 2005/0283985
Method of Measuring Interfacial Adhesion Properties of Electronic Structures
Patent: 7,287,418 →
Application: 11/316,142 →
Publication: US 2006/0137468
Method of Measuring Interfacial Adhesion Properties of Stents
Patent: 7,287,419 →
Application: 11/316,143 →
Publication: US 2006/0191327
Method of Measuring Properties of Interfacial Adhesion
Patent: 7,628,065 →
Application: 11/316,456 →
Publication: US 2006/0137440
Method of Measuring Properties of Interfacial Adhesion of Medical Device Coatings
Patent: 7,287,420 →
Application: 11/316,471 →
Publication: US 2006/0137469
Multi-Scale & Three-Axis Sensing Tensile Testing Apparatus
Patent: 7,681,459 →
Application: 11/539,028 →
Surface Evaluation Employing Orthogonal Force Measurement
Patent: 8,186,210 →
Application: 12/471,036 →
Publication: US 2009/0320575
Micromachined Comb Drive for Quantitative Nanoindentation
Patent: 8,161,803 →
Application: 12/497,834 →
Publication: US 2010/0132441
Digital Damping Control of Nanomechanical Test Instruments
Patent: 8,738,315 →
Application: 12/498,238 →
Publication: US 2010/0036636
2-D Mems Tribometer with Comb Drives
Patent: 9,157,845 →
Application: 13/099,113 →
Publication: US 2011/0265559
Microelectromechanical Transducer and Test System
Patent: 9,404,841 →
Application: 13/685,254 →
Publication: US 2013/0098144
Method of Measuring an Interaction Force
Patent: 9,335,240 →
Application: 13/688,034 →
Publication: US 2013/0098145
Related Assignments (14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 27, 2001
From: DAUGELA, ANTANAS
To: HYSITRON, INC.
Reel/Frame 011932/0650 →
Assignment of Assignor's Interest Jun 28, 2001
From: DAUGELA, ANTANAS
To: HYSITRON, INC.
Reel/Frame 011701/0444 →
Assignment of Assignor's Interest Dec 22, 2005
From: YANG, DEHUA; VODNICK, DAVID J.; NAY, RICHARD J.; WYROBEK, THOMAS J.
To: HYSITRON, INC.
Reel/Frame 017413/0547 →
Assignment of Assignor's Interest Dec 22, 2005
From: YANG, DEHUA; VODNICK, DAVID J.; NAY, RICHARD J.; WYROBEK, THOMAS J.
To: HYSITRON, INC.
Reel/Frame 017409/0017 →
Assignment of Assignor's Interest Dec 22, 2005
From: YANG, DEHUA; VODNICK, DAVID J.; NAY, RICHARD J.; WYROBEK, THOMAS J.
To: HYSITRON, INC.
Reel/Frame 017413/0782 →
Assignment of Assignor's Interest Dec 22, 2005
From: YANG, DEHUA; VODNICK, DAVID J.; NAY, RICHARD J.; WYROBEK, THOMAS J.
To: HYSITRON, INC.
Reel/Frame 017408/0980 →
Assignment of Assignor's Interest Jun 15, 2006
From: YANG, PH.D, DEHUA; WYROBEK, THOMAS J.
To: HYSITRON, INCORPORATED
Reel/Frame 017796/0244 →
Assignment of Assignor's Interest Oct 5, 2006
From: YANG, DEHUA, PH.D; WYROBEK, THOMAS J.
To: HYSITRON, INCORPORATED
Reel/Frame 018355/0073 →
Assignment of Assignor's Interest Sep 21, 2009
From: HANGEN, UDE DIRK
To: HYSITRON INCORPORATED
Reel/Frame 023258/0173 →
Assignment of Assignor's Interest Oct 20, 2009
From: OH, YUNJE; WILSON, MATTHEW R.; MAJOR, RYAN CHARLES; SYED ASIF, SYED AMANULA
To: HYSITRON INCORPORATED
Reel/Frame 023396/0445 →
Assignment of Assignor's Interest Oct 22, 2009
From: OH, YUNJE; SYED ASIF, SYED AMANULA; WARREN, ODEN L.
To: HYSITRON INCORPORATED
Reel/Frame 023410/0422 →
Assignment of Assignor's Interest Jul 18, 2011
From: OH, YUNJE; ASIF, SYED AMANULA SYED; WARREN, ODEN L.
To: HYSITRON INCORPORATED
Reel/Frame 026604/0439 →
Assignment of Assignor's Interest Feb 6, 2013
From: OH, YUNJE; MAJOR, RYAN; STAUFFER, DOUGLAS; SYED ASIF, SYED AMANULA
To: HYSITRON INCORPORATED
Reel/Frame 029761/0621 →
Assignment of Assignor's Interest Apr 25, 2013
From: OH, YUNJE; ASIF, SYED AMANULA SYED; WARREN, ODEN
To: HYSITRON, INC.
Reel/Frame 030287/0552 →