Patent Assignment
Reel/Frame 047083/0777
Assignment of Assignor's Interest
Recorded: 2018-10-05
Pages: 2
Assignors
WANG, SHIANG-BAU
Executed: 2018-09-28
YIN, LI-WEI
Executed: 2018-09-28
HSU, SHAO-HUA
Executed: 2018-09-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Cut-Fin Isolation Regions and Method Forming Same