IP Library Assignment 047087/0296
Patent Assignment
Reel/Frame 047087/0296

Assignment of Assignor's Interest

Recorded: 2018-10-07 Pages: 3
Assignors
SEE, GUAN HUEI
Executed: 2018-09-26
LIANTO, PRAYUDI
Executed: 2018-09-26
GU, YU
Executed: 2018-09-26
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property (1)
Methods of Thinning Si on Epoxy Mold Compound for Rf Applications
Application: 62/735,581 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 5, 2019
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 050917/0604 →