Patent Assignment
Reel/Frame 050917/0604
Assignment of Assignor's Interest
Recorded: 2019-11-05
Pages: 6
Assignor
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Executed: 2019-10-03
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(34)
Methods and Apparatus for Reconfigurable Flow Control in Process Chambers
Application:
16/010,899 →
Publication:
US 2019/0385874
Method and Apparatus for Uniform Thermal Distribution in a Microwave Cavity During Semiconductor Processing
Application:
15/966,211 →
Publication:
US 2018/0323091
Method and Apparatus for Backside Cleaning of Substrates
Method of Forming a Magnetic Core on a Substrate
Methods of Thinning Si on Epoxy Mold Compound for Rf Applications
Application:
62/735,581 →
Methods and Apparatus for Controlling Warpage in Wafer Level Packaging Processes
Application:
62/751,200 →
Methods for Bonding Substrates
Application:
62/751,819 →
Batch Substrate Support with Warped Substrate Capability
Methods for Forming Microwave Tunable Composited Thin-Film Dielectric Layer
Application:
62/784,977 →
Adhesive-Less Substrate Bonding to Carrier Plate
Application:
62/785,781 →
Methods for Forming Vias in Polymer Layers
Patent:
10,636,696 →
Application:
16/251,355 →
Physcial Vapor Deposition Apparatus
Deposition Ring for Processing Reduced Size Substrates
Application:
16/273,808 →
Publication:
US 2019/0259647
Apparatus for Handling Various Sized Substrates
Process Kit for Processing Reduced Sized Substrates
Application:
16/273,390 →
Publication:
US 2019/0259635
Adhesive-Less Substrate Bonding to Carrier Plate
Methods and Apparatus for Removing Abrasive Particles
Application:
16/363,009 →
Publication:
US 2020/0306931
Methods and Apparatus for Microwave Leakage Reduction for Semiconductor Process Chambers
Two Piece Shutter Disk Assembly with Self-Centering Feature
Methods, Apparatuses and Systems for Substrate Processing for Lowering Contact Resistance
Water Cooled Plate for Heat Management in Power Amplifiers
Application:
62/843,299 →
Methods and Apparatus for Cleaving of Semiconductor Substrates
Pre-Clean Chamber with Integrated Shutter Garage
Inline Microwave Batch Degas Chamber
Methods for Forming Microwave Tunable Composited Thin-Film Dielectric Layer
Water Cooled Plate for Heat Management in Power Amplifiers
Methods and Apparatus for Microwave Processing of Polymer Materials
Application:
62/871,181 →
Methods for Bonding Substrates
Methods and Apparatus for Substrate Warpage Correction
Application:
62/880,247 →
Methods and Apparatus for Determining Endpoints for Chemical Mechanical Planarization in Wafer-Level Packaging Applications
Application:
16/545,997 →
Publication:
US 2021/0057292
Methods and Apparatus for Processing a Substrate Using Microwave Energy
Methods and Apparatus for Contactless Substrate Warpage Correction
Application:
16/545,752 →
Publication:
US 2021/0057238
Sputtering Target for a Physical Vapor Deposition Chamber
Patent:
908,645 →
Application:
29/703,194 →
Methods of Thinning Silicon on Epoxy Mold Compound for Radio Frequency (Rf) Applications
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 16, 2018
From: NEMANI, SRINIVAS D.
To: APPLIED MATERIALS, INC.
Reel/Frame 045820/0359 →
Assignment of Assignor's Interest
Jun 6, 2018
From: THIRUNAVUKARASUM, SRISKANTHARAJAH; LEW, JEN SERN; SUNDARRAJAN, ARVIND
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 046005/0311 →
Assignment of Assignor's Interest
Aug 21, 2018
From: SUO, PENG; GU, YU; SEE, GUAN HUEI; SUNDARRAJAN, ARVIND
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 046638/0474 →
Assignment of Assignor's Interest
Oct 7, 2018
From: SEE, GUAN HUEI; LIANTO, PRAYUDI; GU, YU
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 047087/0296 →
Assignment of Assignor's Interest
Oct 8, 2018
From: RAO, PREETHAM; JUPUDI, ANANTHKRISHNA; OW, YUEH SHENG
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 047096/0810 →
Assignment of Assignor's Interest
Nov 9, 2018
From: RAO, PREETHAM P.; JUPUDI, ANANTHKRISHNA; KOH, TUCK FOONG
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 047462/0187 →
Assignment of Assignor's Interest
Nov 9, 2018
From: GULEDGUDD, MADHUKAR; GAUTAM, RIBHU
To: APPLIED MATERIALS, INC.
Reel/Frame 047462/0331 →
Assignment of Assignor's Interest
Jan 16, 2019
From: THIRUNAVUKARASU, SRISKANTHARAJAH; SUNDARRAJAN, ARVIND; PARATHITHASAN, KARRTHIK; PENG, QI JIE
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 048031/0235 →
Assignment of Assignor's Interest
Jan 16, 2019
From: OW, YUEH SHENG; CUI, YUE; SUNDARRAJAN, ARVIND; CHEN, NUNO YEN-CHU
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 048031/0104 →
Assignment of Assignor's Interest
Jan 18, 2019
From: PATEL, SHASHIDHARA; GAUTAM, RIBHU
To: APPLIED MATERIALS, INC.
Reel/Frame 048057/0953 →
Assignment of Assignor's Interest
Jan 18, 2019
From: JUPUDI, ANANTHKRISHNA
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 048058/0008 →
Assignment of Assignor's Interest
Feb 12, 2019
From: GU, YU; SEE, GUAN HUEI; SUO, PENG; LIANTO, PRAYUDI
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 048308/0099 →
Corrective Assignment to Correct the Execution Date for Inventor Prayudi Lianto Previously Recorded on Reel 048308 Frame 0099. Assignor(S) Hereby Confirms the Assignment.
Feb 28, 2019
From: GU, YU; SEE, GUAN HUEI; SUO, PENG; LIANTO, PRAYUDI
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 048485/0583 →
Assignment of Assignor's Interest
Mar 15, 2019
From: WEI, JUNQI; OW, YUEH SHENG; SHOO, WEN LONG FAVIER
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 048613/0363 →
Assignment of Assignor's Interest
Apr 9, 2019
From: LIANTO, PRAYUDI; SEE, GUAN HUEI; THIRUNAVUKARASU, SRISKANTHARAJAH; SUNDARRAJAN, ARVIND
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 048834/0682 →
Assignment of Assignor's Interest
Apr 9, 2019
From: MAHADEV, ANAND; VAYYAPRON, SHOJU
To: APPLIED MATERIALS, INC.
Reel/Frame 048834/0301 →
Assignment of Assignor's Interest
Apr 9, 2019
From: PARATHITHASAN, KARRTHIK; LIM, FANG JIE; THIRUNAVUKARASU, SRISKANTHARAJAH; PEH, ENG SHENG
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 048834/0365 →
Assignment of Assignor's Interest
Apr 9, 2019
From: THIRUNAVUKARASU, SRISKANTHARAJAH; SUNDARRAJAN, ARVIND; PARATHITHASAN, KARRTHIK; PENG, QI JIE
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 048834/0525 →
Assignment of Assignor's Interest
Apr 22, 2019
From: THIRUNAVUKARASU, SRISKANTHARAJAH; PEH, ENG SHENG; PARATHITHASAN, KARRTHIK; LIM, FANG JIE
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 048955/0951 →
Assignment of Assignor's Interest
May 3, 2019
From: JUPUDI, ANANTHKRISHNA; BABU, SARATH
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 049071/0923 →
Assignment of Assignor's Interest
May 3, 2019
From: TSAI, CHENG-HSIUNG
To: APPLIED MATERIALS, INC.
Reel/Frame 049071/0820 →
Assignment of Assignor's Interest
May 17, 2019
From: JUPUDI, ANANTHKRISHNA; RAMACHANDRAN, VINODH
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 049209/0705 →
Assignment of Assignor's Interest
May 17, 2019
From: GAUTAM, RIBHU
To: APPLIED MATERIALS, INC.
Reel/Frame 049209/0790 →
Assignment of Assignor's Interest
May 17, 2019
From: SHIMIZU, TAKASHI
To: APPLIED MATERIALS, INC.
Reel/Frame 049210/0240 →
Assignment of Assignor's Interest
May 31, 2019
From: OW, YUEH SHENG; WEI, JUNQI; SHOO, WEN LONG FAVIER; JUPUDI, ANANTHKRISHNA
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 049331/0400 →