Patent Assignment
Reel/Frame 048834/0525
Assignment of Assignor's Interest
Recorded: 2019-04-09
Pages: 4
Assignors
THIRUNAVUKARASU, SRISKANTHARAJAH
Executed: 2019-03-13
SUNDARRAJAN, ARVIND
Executed: 2019-03-18
PARATHITHASAN, KARRTHIK
Executed: 2019-03-13
PENG, QI JIE
Executed: 2019-03-13
ARUNAKIRI, MANORAJH
Executed: 2019-03-18
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property
(1)
Adhesive-Less Substrate Bonding to Carrier Plate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.