IP Library Assignment 047089/0781
Patent Assignment
Reel/Frame 047089/0781

Assignment of Assignor's Interest

Recorded: 2018-10-08 Pages: 5
Assignors
FILLION, RAYMOND ALBERT
Executed: 2018-10-04
NAGARKAR, KAUSTUBH RAVINDRA
Executed: 2018-10-04
Assignee
GENERAL ELECTRIC COMPANY
1 RIVER ROAD, SCHENECTADY, NEW YORK, 12345
Covered Property (1)
Multilayer Interconnect Structure with Buried Conductive via Connections and Method of Manufacturing Thereof
Application: 16/153,905 →
Publication: US 2020/0111680
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 20, 2025
From: DOLBY INTELLECTUAL PROPERTY LICENSING, LLC
To: EDISON INNOVATIONS, LLC
Reel/Frame 071674/0420 →
Change of Name Jun 23, 2025
From: GE INTELLECTUAL PROPERTY LICENSING, LLC
To: DOLBY INTELLECTUAL PROPERTY LICENSING, LLC
Reel/Frame 071692/0511 →
Assignment of Assignor's Interest Jun 23, 2025
From: GENERAL ELECTRIC COMPANY
To: GE INTELLECTUAL PROPERTY LICENSING, LLC
Reel/Frame 071704/0816 →