Patent Assignment
Reel/Frame 047090/0669
Assignment of Assignor's Interest
Recorded: 2018-10-08
Pages: 3
Assignor
DARVEAUX, ROBERT FRANCIS
Executed: 2018-04-26
Assignee
SKYWORKS SOLUTIONS, INC.
20 SYLVAN ROAD, WOBURN, MASSACHUSETTS, 01801
Covered Property
(1)
Control of Under-Fill with a Packaging Substrate Having an Integrated Trench for a Dual-Sided Ball Grid Array Package