IP Library › Assignment 047093/0256
Patent Assignment
Reel/Frame 047093/0256

Assignment of Assignor's Interest

Recorded: 2018-10-08 Pages: 3
Assignor
YANG, GUANGJUN
Executed: 2018-10-03
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 1-507, BOISE, IDAHO, 83707-0006
Covered Property (1)
Methods of Forming Semiconductor Devices Using Mask Materials, and Related Semiconductor Devices and Systems
Application: 16/154,088 →
Publication: US 2020/0111673
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 12 to Patent Security Agreement Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048948/0677 →
Supplement No. 3 to Patent Security Agreement Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048951/0902 →
Release of Security Interest Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050724/0392 →
Release of Security Interest Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051041/0317 →