Patent Assignment
Reel/Frame 047096/0606
Assignment of Assignor's Interest
Recorded: 2018-10-08
Pages: 4
Assignors
CHING, KUO-CHENG
Executed: 2018-08-13
TSAI, CHING-WEI
Executed: 2018-09-11
CHENG, KUAN-LUN
Executed: 2018-09-12
WANG, CHIH-HAO
Executed: 2018-08-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Component and Fabricating Method Thereof