Patent Assignment
Reel/Frame 047098/0224
Assignment of Assignor's Interest
Recorded: 2018-10-09
Pages: 5
Assignors
LIAO, SIH-HAO
Executed: 2018-09-26
YU, CHEN-HUA
Executed: 2018-09-26
KUO, HUNG-JUI
Executed: 2018-09-26
HU, YU-HSIANG
Executed: 2018-09-26
CHEN, WEI-CHIH
Executed: 2018-09-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Wafer Chuck