Patent Assignment
Reel/Frame 047104/0418
Assignment of Assignor's Interest
Recorded: 2018-10-09
Pages: 5
Assignors
LEE, SIN-YEOB
Executed: 2018-06-25
SHIN, DONG-WOO
Executed: 2018-06-27
CHOI, HYUN-SEOK
Executed: 2018-06-27
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Solder Reflow Apparatus and Method of Manufacturing an Electronic Device