Patent Assignment
Reel/Frame 047104/0500
Assignment of Assignor's Interest
Recorded: 2018-10-09
Pages: 6
Assignors
KIM, JAE CHOON
Executed: 2018-07-16
PARK, WOO HYUN
Executed: 2018-08-04
JANG, EON SOO
Executed: 2018-07-16
CHO, YOUNG SANG
Executed: 2018-07-16
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including a Thermal Conductive Layer and Method of Manufacturing the Same