Patent Assignment
Reel/Frame 047127/0935
Assignment of Assignor's Interest
Recorded: 2018-10-10
Pages: 4
Assignee
WINBOND ELECTRONICS CORP.
NO. 8 KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK,, TAICHUNG CITY, TAIWAN
Covered Property
(1)
Manufacturing Method of Semiconductor Chip