IP Library Assignment 047147/0001
Patent Assignment
Reel/Frame 047147/0001

Assignment of Assignor's Interest

Recorded: 2018-10-12 Pages: 2
Assignors
LIAO, HSIU-HAN
Executed: 2018-09-06
CHUANG, CHE-FU
Executed: 2018-09-06
Assignee
WINBOND ELECTRONICS CORP.
NO. 8, KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK, TAICHUNG CITY, R.O.C., TAIWAN
Covered Property (1)
Semiconductor Wafer with Test Key Structure
Application: 16/155,496 →
Publication: US 2019/0181063