IP Library Assignment 047147/0714
Patent Assignment
Reel/Frame 047147/0714

Assignment of Assignor's Interest

Recorded: 2018-10-12 Pages: 3
Assignors
YASUDA, KAZUHARU
Executed: 2018-05-23
UMEI, YUO
Executed: 2018-05-23
ICHIKI, HIDEAKI
Executed: 2018-05-24
SUGANO, SUSUMU
Executed: 2018-05-31
Assignee
ASAHI KASEI KABUSHIKI KAISHA
1-105, KANDA JINBOCHO, CHIYODA-KU, TOKYO, 101-8101, JAPAN
Covered Property (1)
Molding Die and Compression Molding Method
Application: 16/093,091 →
Publication: US 2019/0126521