Molding die and compression molding Method
A molding die and a molding method are provided, which allow high-cycle manufacturing of molded bodies of a thermoplastic resin or thermoplastic resin-fiber composite material, thereby improving productivity. Molding is performed using a molding die including a plurality of die portions that form a cavity in which a molded body is molded, the molding die including: a first temperature adjusting unit disposed in the vicinity of the cavity surface and capable of at least cooling the cavity surface; and a second temperature adjusting unit disposed on a side of the first temperature adjusting unit opposite from the cavity surface and capable of at least heating the cavity surface, wherein a distance L 0 from the cavity surface to the first temperature adjusting unit and a distance L 1 from the cavity surface to a surface of the corresponding die portion opposite from the cavity surface satisfy the relationship: (L 1 /L 0 )>3.
1. A molding die comprising a plurality of die portions that form a cavity in which a molded body is molded, the molding die comprising:
a first temperature adjusting unit disposed in the vicinity of a cavity surface, the first temperature adjusting unit being capable of at least cooling the cavity surface; and
a second temperature adjusting unit disposed on a side of the first temperature adjusting unit opposite from the cavity surface, the second temperature adjusting unit being capable of at least heating the cavity surface,
wherein a distance L 0 from the cavity surface to the first temperature adjusting unit and a distance L 1 from the cavity surface to a surface of the corresponding die portion opposite from the cavity surface satisfy the following relationship:
( L 1 / L 0 )>3;
wherein:
each die portion comprises a first section including the first temperature adjusting unit, and a second section including the second temperature adjusting unit,
a volume V(I) of the first section of the die portion and a volume V 0 of the die portion satisfy the following relationship:
1.3<( V 0 / V ( I ))<3; and
a material forming the first section has a thermal conductivity C(I) (J/s·m·K) that is 3.5 times or more a thermal conductivity C(II) (J/s·m·K) of a material forming the second section, and/or the material forming the first section has a thermal diffusivity (m 2 /s) that is 3.5 times or more a thermal diffusivity (m 2 /s) of the material forming the second section.
2. The molding die as claimed in claim 1 , wherein a distance L 2 from the first temperature adjusting unit to the second temperature adjusting unit satisfies the following relationship:
L 2> L 0.
3. The molding die as claimed in claim 1 , wherein a material forming the first section has a thermal conductivity C(I) (J/s·m·K) of 100 J/s·m·K or more.
4. The molding die as claimed in claim 1 , wherein a material forming the first section has a hardness HB of 200 or more.
5. The molding die as claimed in claim 4 , wherein the material forming the first section has a hardness HB of 250 or more.
6. The molding die as claimed in claim 1 , wherein the first section and the second section are able to be spaced apart from each other when cooling of the cavity surface is performed.
7. The molding die as claimed in claim 1 , wherein the first temperature adjusting unit comprises a plurality of cooling medium paths through which a cooling medium flows, and at least one manifold configured to let the cooling medium at the same temperature simultaneously flow through the plurality of cooling medium paths.
8. The molding die as claimed in claim 1 , comprising a depressurization path configured to reduce pressure in the cavity when the die is fastened.