Patent Assignment
Reel/Frame 047159/0718
Assignment of Assignor's Interest
Recorded: 2018-10-15
Pages: 3
Assignor
ZHOU, ZHI-BIAO
Executed: 2018-10-05
Assignee
UNITED MICROELECTRONICS CORP.
NO3, LI-HSIN RD.II, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Device and Semiconductor Device Fabricated by the Same
Patent:
10,515,876 →
Application:
16/159,789 →