Patent Assignment
Reel/Frame 047171/0911
Assignment of Assignor's Interest
Recorded: 2018-10-01
Pages: 5
Assignors
PEI, HAO-JAN
Executed: 2018-08-31
LIN, HSIU-JEN
Executed: 2018-08-31
CHEN, WEI-YU
Executed: 2018-08-31
CHUNG, PHILIP YU-SHUAN
Executed: 2018-08-31
CHENG, CHIA-SHEN
Executed: 2018-09-07
HUANG, KUEI-WEI
Executed: 2018-09-10
HSIEH, CHING-HUA
Executed: 2018-09-10
LIU, CHUNG-SHI
Executed: 2018-09-10
YU, CHEN-HUA
Executed: 2018-09-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method