Patent Assignment
Reel/Frame 047199/0539
Assignment of Assignor's Interest
Recorded: 2018-10-17
Pages: 7
Assignors
YUN, DONGJIN
Executed: 2018-09-09
KIM, SEYUN
Executed: 2018-09-09
SEOL, MINSU
Executed: 2018-09-14
LEE, CHANGSEOK
Executed: 2018-09-18
KIM, SEONGHEON
Executed: 2018-09-11
LEE, HYANGSOOK
Executed: 2018-09-09
JUNG, CHANGHOON
Executed: 2018-09-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Conductive Composite Structure for Electronic Device, Method of Preparing the Same, Electrode for Electronic Device Including the Conductive Composite Structure, and Electronic Device Including the Conductive Composite Structure