Patent Assignment
Reel/Frame 047211/0504
Assignment of Assignor's Interest
Recorded: 2018-10-10
Pages: 4
Assignors
ISHIHARA, TERUYUKI
Executed: 2017-08-23
BAN, HIROYUKI
Executed: 2017-08-23
MEI, HAIYING
Executed: 2018-09-18
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board Having Support Plate and Method for Manufacturing Printed Wiring Board Having Support Plate